LM111J/883B vs LM111F feature comparison

LM111J/883B National Semiconductor Corporation

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LM111F NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.15 µA 0.15 µA
Bias Current-Max (IIB) @25C 0.1 µA
Input Offset Voltage-Max 4000 µV 4000 µV
JESD-30 Code R-GDIP-T14 R-CDIP-T14
JESD-609 Code e0 e0
Length 19.43 mm
Neg Supply Voltage Limit-Max -18 V -18 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 1
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Response Time-Nom 200 ns 200 ns
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Supply Current-Max 6 mA 6 mA
Supply Voltage Limit-Max 18 V 18 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 2

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