LM108N-14 vs LM308N feature comparison

LM108N-14 NXP Semiconductors

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LM308N Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description DIP, DIP, DIP8,.3
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Length 9.4 mm
Number of Terminals 8 8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.93 mm
Surface Mount NO NO
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 15
Rohs Code No
Architecture VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C 0.007 µA
Frequency Compensation NO
Input Offset Voltage-Max 10000 µV
JESD-609 Code e0
Low-Offset NO
Number of Functions 1
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Equivalence Code DIP8,.3
Power Supplies +-5/+-20 V
Supply Voltage Limit-Max 18 V
Technology BIPOLAR
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Voltage Gain-Min 15000

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