LM108D vs LM108AP feature comparison

LM108D Freescale Semiconductor

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LM108AP Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS TEXAS INSTRUMENTS INC
Package Description DIP, DIP8,.3 DIP, DIP8,.3
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Frequency Compensation NO NO
Input Offset Voltage-Max 3000 µV 500 µV
JESD-30 Code R-XDIP-T8 R-PDIP-T8
JESD-609 Code e0
Low-Offset NO NO
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 7 1
Part Package Code DIP
Pin Count 8
Average Bias Current-Max (IIB) 0.002 µA
Bias Current-Max (IIB) @25C 0.002 µA
Common-mode Reject Ratio-Min 96 dB
Common-mode Reject Ratio-Nom 96 dB
Length 9.81 mm
Neg Supply Voltage Limit-Max -20 V
Neg Supply Voltage-Nom (Vsup) -15 V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm
Slew Rate-Nom 0.2 V/us
Supply Current-Max 0.6 mA
Supply Voltage Limit-Max 20 V
Supply Voltage-Nom (Vsup) 15 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Unity Gain BW-Nom 1000
Voltage Gain-Min 80000
Width 7.62 mm

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