LH4003CD
vs
LH4006CD
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DIP, DIP24,.6
|
DIP, DIP24,.6
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
BUFFER
|
BUFFER
|
| Average Bias Current-Max (IIB) |
200 µA
|
300 µA
|
| Bandwidth (3dB)-Nom |
250 MHz
|
350 MHz
|
| Bias Current-Max (IIB) @25C |
200 µA
|
300 µA
|
| Input Offset Voltage-Max |
15000 µV
|
15000 µV
|
| JESD-30 Code |
R-CDIP-T24
|
R-CDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Neg Supply Voltage Limit-Max |
-8 V
|
-8 V
|
| Neg Supply Voltage-Nom (Vsup) |
-6 V
|
-6 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.6
|
DIP24,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.232 mm
|
5.232 mm
|
| Slew Rate-Min |
1000 V/us
|
1000 V/us
|
| Slew Rate-Nom |
1200 V/us
|
1200 V/us
|
| Supply Current-Max |
65 mA
|
65 mA
|
| Supply Voltage Limit-Max |
8 V
|
8 V
|
| Supply Voltage-Nom (Vsup) |
6 V
|
6 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
HYBRID
|
HYBRID
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
15.24 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
24
|
|
|
|