LGN2W221MHLC25
vs
CESMS2W221M3530TC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NICHICON CORP
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
,
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8532.22.00
|
|
| Capacitance |
220 µF
|
220 µF
|
| Capacitor Type |
ALUMINUM ELECTROLYTIC CAPACITOR
|
ALUMINUM ELECTROLYTIC CAPACITOR
|
| Dielectric Material |
ALUMINUM (WET)
|
ALUMINUM (WET)
|
| JESD-609 Code |
e0
|
|
| Leakage Current |
0.94 mA
|
2.97 mA
|
| Manufacturer Series |
GN
|
SMS
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
| Negative Tolerance |
20%
|
20%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Shape |
CYLINDRICAL PACKAGE
|
CYLINDRICAL PACKAGE
|
| Polarity |
POLARIZED
|
POLARIZED
|
| Positive Tolerance |
20%
|
20%
|
| Rated (DC) Voltage (URdc) |
450 V
|
450 V
|
| Ripple Current |
1050 mA
|
1550 mA
|
| Surface Mount |
NO
|
NO
|
| Tan Delta |
0.2
|
0.25
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Shape |
SNAP-IN
|
SNAP-IN
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LGN2W221MHLC25 with alternatives
Compare CESMS2W221M3530TC with alternatives