LGJ2Z331MHLC15
vs
EETXB2P331CB
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NICHICON CORP
|
PANASONIC CORP
|
| Package Description |
,
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8532.22.00
|
|
| Additional Feature |
LOW PROFILE
|
|
| Capacitance |
330 µF
|
330 µF
|
| Capacitor Type |
ALUMINUM ELECTROLYTIC CAPACITOR
|
ALUMINUM ELECTROLYTIC CAPACITOR
|
| Dielectric Material |
ALUMINUM (WET)
|
ALUMINUM (WET)
|
| JESD-609 Code |
e0
|
e3
|
| Leakage Current |
0.73116 mA
|
|
| Manufacturer Series |
GJ
|
TS-XB
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
| Negative Tolerance |
20%
|
20%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Shape |
CYLINDRICAL PACKAGE
|
CYLINDRICAL PACKAGE
|
| Polarity |
POLARIZED
|
POLARIZED
|
| Positive Tolerance |
20%
|
20%
|
| Rated (DC) Voltage (URdc) |
180 V
|
180 V
|
| Ripple Current |
1100 mA
|
1200 mA
|
| Surface Mount |
NO
|
NO
|
| Tan Delta |
0.2
|
0.15
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin (Sn)
|
| Terminal Shape |
SNAP-IN
|
SNAP-IN
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| ESR |
|
536 mΩ
|
|
|
|
Compare LGJ2Z331MHLC15 with alternatives
Compare EETXB2P331CB with alternatives