LFXP3C-3TN100C
vs
LFXP3C-3T100C
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
14 X 14 MM, LEAD FREE, TQFP-100
|
14 X 14 MM, TQFP-100
|
Pin Count |
100
|
100
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
375 MHz
|
375 MHz
|
Combinatorial Delay of a CLB-Max |
0.63 ns
|
0.63 ns
|
JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
JESD-609 Code |
e3
|
e0
|
Length |
14 mm
|
14 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
384
|
384
|
Number of Inputs |
62
|
62
|
Number of Logic Cells |
384
|
384
|
Number of Outputs |
62
|
62
|
Number of Terminals |
100
|
100
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
384 CLBS
|
384 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LFQFP
|
Package Equivalence Code |
QFP100,.63SQ,20
|
QFP100,.63SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Supply Voltage-Max |
3.465 V
|
3.465 V
|
Supply Voltage-Min |
1.71 V
|
1.71 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare LFXP3C-3TN100C with alternatives
Compare LFXP3C-3T100C with alternatives