LFXP3C-3Q208NI
vs
LFXP3C-4Q208C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
QFP
QFP
Package Description
FQFP,
28 X 28 MM, PLASTIC, QFP-208
Pin Count
208
208
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
375 MHz
375 MHz
Combinatorial Delay of a CLB-Max
0.63 ns
0.53 ns
JESD-30 Code
S-PQFP-G208
S-PQFP-G208
Length
28 mm
28 mm
Number of CLBs
384
384
Number of Inputs
136
136
Number of Outputs
136
136
Number of Terminals
208
208
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
384 CLBS
384 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
FQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
FLATPACK, FINE PITCH
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
4.1 mm
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
1.71 V
1.71 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
28 mm
28 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
ECCN Code
EAR99
JESD-609 Code
e0
Moisture Sensitivity Level
3
Number of Logic Cells
384
Package Equivalence Code
QFP208,1.2SQ,20
Peak Reflow Temperature (Cel)
225
Technology
CMOS
Terminal Finish
Tin/Lead (Sn85Pb15)
Time@Peak Reflow Temperature-Max (s)
30
Compare LFXP3C-3Q208NI with alternatives
Compare LFXP3C-4Q208C with alternatives