LFX200EB-04F516I
vs
LFX200B-04FH516I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
BGA, BGA516,30X30,40
FPBGA-516
Pin Count
516
516
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ALSO OPERATES WITH 3.3V SUPPLY
ALSO OPERATES WITH 3.3V SUPPLY
Clock Frequency-Max
134 MHz
Combinatorial Delay of a CLB-Max
0.93 ns
0.93 ns
JESD-30 Code
S-PBGA-B516
S-PBGA-B516
JESD-609 Code
e0
e0
Length
31 mm
31 mm
Moisture Sensitivity Level
3
3
Number of CLBs
676
676
Number of Equivalent Gates
210000
210000
Number of Inputs
208
208
Number of Logic Cells
2704
2704
Number of Outputs
208
208
Number of Terminals
516
516
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
676 CLBS, 210000 GATES
676 CLBS, 210000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA516,30X30,40
BGA516,30X30,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
2.7 V
2.7 V
Supply Voltage-Min
2.3 V
2.3 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
31 mm
31 mm
Base Number Matches
1
1
Pbfree Code
Compare LFX200EB-04F516I with alternatives
Compare LFX200B-04FH516I with alternatives