LFX200EB-03FH516I
vs
LFX200EB-05FH516C
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
BGA, BGA516,30X30,40
|
Pin Count |
516
|
516
|
Reach Compliance Code |
unknown
|
not_compliant
|
Additional Feature |
ALSO OPERATES WITH 3.3V SUPPLY
|
ALSO OPERATES WITH 3.3V SUPPLY
|
Combinatorial Delay of a CLB-Max |
1.07 ns
|
0.86 ns
|
JESD-30 Code |
S-PBGA-B516
|
S-PBGA-B516
|
JESD-609 Code |
e0
|
e0
|
Length |
31 mm
|
31 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
676
|
676
|
Number of Equivalent Gates |
210000
|
210000
|
Number of Terminals |
516
|
516
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
676 CLBS, 210000 GATES
|
676 CLBS, 210000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
2.6 mm
|
2.6 mm
|
Supply Voltage-Max |
2.7 V
|
2.7 V
|
Supply Voltage-Min |
2.3 V
|
2.3 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
31 mm
|
31 mm
|
Base Number Matches |
2
|
1
|
HTS Code |
|
8542.39.00.01
|
Clock Frequency-Max |
|
139 MHz
|
Number of Inputs |
|
208
|
Number of Logic Cells |
|
2704
|
Number of Outputs |
|
208
|
Package Equivalence Code |
|
BGA516,30X30,40
|
|
|
|
Compare LFX200EB-05FH516C with alternatives