LFX200EB-03FH516I vs LFX200EB-05FH516C feature comparison

LFX200EB-03FH516I Rochester Electronics LLC

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LFX200EB-05FH516C Lattice Semiconductor Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description BGA, BGA, BGA516,30X30,40
Pin Count 516 516
Reach Compliance Code unknown not_compliant
Additional Feature ALSO OPERATES WITH 3.3V SUPPLY ALSO OPERATES WITH 3.3V SUPPLY
Combinatorial Delay of a CLB-Max 1.07 ns 0.86 ns
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e0 e0
Length 31 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 676 676
Number of Equivalent Gates 210000 210000
Number of Terminals 516 516
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 676 CLBS, 210000 GATES 676 CLBS, 210000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 31 mm 31 mm
Base Number Matches 2 1
HTS Code 8542.39.00.01
Clock Frequency-Max 139 MHz
Number of Inputs 208
Number of Logic Cells 2704
Number of Outputs 208
Package Equivalence Code BGA516,30X30,40

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