LFX200C-03FN256I vs LFX200EC-04F256C feature comparison

LFX200C-03FN256I Lattice Semiconductor Corporation

Buy Now Datasheet

LFX200EC-04F256C Lattice Semiconductor Corporation

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description FPBGA-256 FPBGA-256
Pin Count 256 256
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 1.07 ns 0.93 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 676 676
Number of Equivalent Gates 210000 210000
Number of Terminals 256 256
Organization 676 CLBS, 210000 GATES 676 CLBS, 210000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 2.1 mm
Supply Voltage-Max 1.95 V 1.95 V
Supply Voltage-Min 1.65 V 1.65 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 17 mm 17 mm
Base Number Matches 1 1
Clock Frequency-Max 134 MHz
Number of Inputs 160
Number of Logic Cells 2704
Number of Outputs 160
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Equivalence Code BGA256,16X16,40
Temperature Grade COMMERCIAL

Compare LFX200C-03FN256I with alternatives

Compare LFX200EC-04F256C with alternatives