LFX200C-03FN256I
vs
LFX200EC-04F256C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
FPBGA-256
FPBGA-256
Pin Count
256
256
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Combinatorial Delay of a CLB-Max
1.07 ns
0.93 ns
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e0
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
676
676
Number of Equivalent Gates
210000
210000
Number of Terminals
256
256
Organization
676 CLBS, 210000 GATES
676 CLBS, 210000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
2.1 mm
Supply Voltage-Max
1.95 V
1.95 V
Supply Voltage-Min
1.65 V
1.65 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN SILVER COPPER
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
17 mm
17 mm
Base Number Matches
1
1
Clock Frequency-Max
134 MHz
Number of Inputs
160
Number of Logic Cells
2704
Number of Outputs
160
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Equivalence Code
BGA256,16X16,40
Temperature Grade
COMMERCIAL
Compare LFX200C-03FN256I with alternatives
Compare LFX200EC-04F256C with alternatives