LFX200C-03F256C vs LFX200EC-03FN256C feature comparison

LFX200C-03F256C Lattice Semiconductor Corporation

Buy Now Datasheet

LFX200EC-03FN256C Lattice Semiconductor Corporation

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description FPBGA-256 LEAD FREE, FPBGA-256
Pin Count 256 256
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 124 MHz 124 MHz
Combinatorial Delay of a CLB-Max 1.07 ns 1.07 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 676 676
Number of Equivalent Gates 210000 210000
Number of Inputs 160 160
Number of Logic Cells 2704 2704
Number of Outputs 160 160
Number of Terminals 256 256
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 676 CLBS, 210000 GATES 676 CLBS, 210000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 2.1 mm
Supply Voltage-Max 1.95 V 1.95 V
Supply Voltage-Min 1.65 V 1.65 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn63Pb37) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 17 mm 17 mm
Base Number Matches 1 1

Compare LFX200C-03F256C with alternatives

Compare LFX200EC-03FN256C with alternatives