LFSCM3GA80EP1-6FC1152C
vs
LFSCM3GA80EP1-6FCN1152C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
BGA, BGA1152,34X34,40
35 X 35 MM, LEAD FREE, CERAMIC, FCBGA-1152
Pin Count
1152
1152
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
147.7 MHz
147.7 MHz
Combinatorial Delay of a CLB-Max
0.172 ns
0.172 ns
JESD-30 Code
S-PBGA-B1152
S-CBGA-B1152
JESD-609 Code
e0
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
4
4
Number of CLBs
308
308
Number of Equivalent Gates
80000
80000
Number of Inputs
660
660
Number of Logic Cells
80100
80100
Number of Outputs
660
660
Number of Terminals
1152
1152
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
308 CLBS, 80000 GATES
308 CLBS, 80000 GATES
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.2 mm
5.2 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
40
Width
35 mm
35 mm
Base Number Matches
1
1
ECCN Code
3A991.D
Compare LFSCM3GA80EP1-6FC1152C with alternatives
Compare LFSCM3GA80EP1-6FCN1152C with alternatives