LFSCM3GA15EP1-7F256C vs LFSC3GA15E-7FN256C feature comparison

LFSCM3GA15EP1-7F256C Lattice Semiconductor Corporation

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LFSC3GA15E-7FN256C Lattice Semiconductor Corporation

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 17 X 17 MM, FPBGA-256 17 X 17 MM, LEAD FREE, FPBGA-256
Pin Count 256 256
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 156.25 MHz 156.25 MHz
Combinatorial Delay of a CLB-Max 0.152 ns 0.152 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 56 56
Number of Equivalent Gates 15000 15000
Number of Inputs 139 139
Number of Logic Cells 15200 15200
Number of Outputs 139 139
Number of Terminals 256 256
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 56 CLBS, 15000 GATES 56 CLBS, 15000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 2.1 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 17 mm 17 mm
Base Number Matches 1 1

Compare LFSCM3GA15EP1-7F256C with alternatives

Compare LFSC3GA15E-7FN256C with alternatives