LFSCM3GA15EP1-7F256C
vs
LFSC3GA15E-7FN256C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
17 X 17 MM, FPBGA-256
17 X 17 MM, LEAD FREE, FPBGA-256
Pin Count
256
256
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
156.25 MHz
156.25 MHz
Combinatorial Delay of a CLB-Max
0.152 ns
0.152 ns
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
56
56
Number of Equivalent Gates
15000
15000
Number of Inputs
139
139
Number of Logic Cells
15200
15200
Number of Outputs
139
139
Number of Terminals
256
256
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
56 CLBS, 15000 GATES
56 CLBS, 15000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
2.1 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
40
Width
17 mm
17 mm
Base Number Matches
1
1
Compare LFSCM3GA15EP1-7F256C with alternatives
Compare LFSC3GA15E-7FN256C with alternatives