LFSC3GA80E-7FCN1704C
vs
LFSCM3GA80EP1-7FCN1704C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
42.5 X 42.5 MM, LEAD FREE, CERAMIC, FCBGA-1704
42.5 X 42.5 MM, LEAD FREE, CERAMIC, FCBGA-1704
Pin Count
1704
1704
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
156.25 MHz
156.25 MHz
Combinatorial Delay of a CLB-Max
0.152 ns
0.152 ns
JESD-30 Code
S-CBGA-B1704
S-CBGA-B1704
JESD-609 Code
e1
e1
Length
42.5 mm
42.5 mm
Moisture Sensitivity Level
4
4
Number of CLBs
308
308
Number of Equivalent Gates
80000
80000
Number of Inputs
904
904
Number of Logic Cells
80100
80100
Number of Outputs
904
904
Number of Terminals
1704
1704
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
308 CLBS, 80000 GATES
308 CLBS, 80000 GATES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Equivalence Code
BGA1704,42X42,40
BGA1704,42X42,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.3 mm
5.3 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
40
Width
42.5 mm
42.5 mm
Base Number Matches
1
1
Compare LFSC3GA80E-7FCN1704C with alternatives
Compare LFSCM3GA80EP1-7FCN1704C with alternatives