LFSC3GA115E-6FCN1152I
vs
LFSCM3GA115EP1-6FC1152I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40
Pin Count
1152
1152
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
147.7 MHz
147.7 MHz
Combinatorial Delay of a CLB-Max
0.172 ns
0.172 ns
JESD-30 Code
S-CBGA-B1152
S-PBGA-B1152
JESD-609 Code
e1
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
4
4
Number of CLBs
424
424
Number of Equivalent Gates
115000
115000
Number of Inputs
660
660
Number of Logic Cells
115200
115200
Number of Outputs
660
660
Number of Terminals
1152
1152
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
424 CLBS, 115000 GATES
424 CLBS, 115000 GATES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.2 mm
5.2 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
35 mm
35 mm
Base Number Matches
1
1
Compare LFSC3GA115E-6FCN1152I with alternatives
Compare LFSCM3GA115EP1-6FC1152I with alternatives