LFE3-70E-7FN1156C
vs
LFE3-70EA-6FN1156C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
BGA, BGA1156,34X34,40
Pin Count
1156
1156
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
420 MHz
2645 MHz
JESD-30 Code
S-PBGA-B1156
S-PBGA-B1156
JESD-609 Code
e1
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of Inputs
490
490
Number of Logic Cells
67000
67000
Number of Outputs
490
490
Number of Terminals
1156
1156
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1156,34X34,40
BGA1156,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
35 mm
Base Number Matches
1
1
ECCN Code
3A991.D
Samacsys Manufacturer
Lattice Semiconductor
Combinatorial Delay of a CLB-Max
0.335 ns
Number of CLBs
8375
Organization
8375 CLBS
Compare LFE3-70E-7FN1156C with alternatives
Compare LFE3-70EA-6FN1156C with alternatives