LFE2M70SE-7FN1152C
vs
LFE2M70E-5F1152C
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
No
Rohs Code
Yes
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
FPBGA-1152
FPBGA-1152
Pin Count
1152
1152
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
420 MHz
311 MHz
Combinatorial Delay of a CLB-Max
0.304 ns
0.358 ns
JESD-30 Code
S-PBGA-B1152
S-PBGA-B1152
JESD-609 Code
e1
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of CLBs
8375
Number of Inputs
436
436
Number of Logic Cells
70000
70000
Number of Outputs
436
436
Number of Terminals
1152
1152
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
35 mm
35 mm
Base Number Matches
1
1
Organization
8375 CLBS
Compare LFE2M70SE-7FN1152C with alternatives
Compare LFE2M70E-5F1152C with alternatives