LFE2M70E-6F1152I vs LFE2M70SE-5F1152I feature comparison

LFE2M70E-6F1152I Lattice Semiconductor Corporation

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LFE2M70SE-5F1152I Lattice Semiconductor Corporation

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description FPBGA-1152 FPBGA-1152
Pin Count 1152 1152
Reach Compliance Code unknown unknown
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 357 MHz 311 MHz
Combinatorial Delay of a CLB-Max 0.331 ns 0.358 ns
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of Inputs 436 436
Number of Logic Cells 70000 70000
Number of Outputs 436 436
Number of Terminals 1152 1152
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8375 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1

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Compare LFE2M70SE-5F1152I with alternatives