LFE2M70E-5FN1152I
vs
LFE2M70E-6FN1152I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
FPBGA-1152
FPBGA-1152
Pin Count
1152
1152
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
311 MHz
357 MHz
Combinatorial Delay of a CLB-Max
0.358 ns
0.331 ns
JESD-30 Code
S-PBGA-B1152
S-PBGA-B1152
JESD-609 Code
e1
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of CLBs
8375
8375
Number of Inputs
436
436
Number of Logic Cells
70000
70000
Number of Outputs
436
436
Number of Terminals
1152
1152
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8375 CLBS
8375 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
40
Width
35 mm
35 mm
Base Number Matches
1
1
Compare LFE2M70E-5FN1152I with alternatives
Compare LFE2M70E-6FN1152I with alternatives