LFE2M50E-6F900I
vs
ORSPI4-2F1156C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
FPBGA-900
35 X 35 MM, FPBGA-1156
Pin Count
900
1156
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
357 MHz
185 MHz
Combinatorial Delay of a CLB-Max
0.331 ns
JESD-30 Code
S-PBGA-B900
S-PBGA-B1156
JESD-609 Code
e0
e0
Length
31 mm
35 mm
Moisture Sensitivity Level
3
3
Number of Inputs
410
Number of Logic Cells
50000
Number of Outputs
410
Number of Terminals
900
1156
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
6000 CLBS
2024 CLBS, 471000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA900,30X30,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
3.6 V
Supply Voltage-Min
1.14 V
3 V
Supply Voltage-Nom
1.2 V
3.3 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
31 mm
35 mm
Base Number Matches
1
2
Number of CLBs
2024
Number of Equivalent Gates
471000
Compare LFE2M50E-6F900I with alternatives
Compare ORSPI4-2F1156C with alternatives