LFE2M50E-5FN900C vs LFE2M50E-5F900C feature comparison

LFE2M50E-5FN900C Lattice Semiconductor Corporation

Buy Now Datasheet

LFE2M50E-5F900C Lattice Semiconductor Corporation

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description FPBGA-900 FPBGA-900
Pin Count 900 900
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Lattice Semiconductor
Clock Frequency-Max 311 MHz 311 MHz
Combinatorial Delay of a CLB-Max 0.358 ns 0.358 ns
JESD-30 Code S-PBGA-B900 S-PBGA-B900
JESD-609 Code e1 e0
Length 31 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6000
Number of Inputs 410 410
Number of Logic Cells 50000 50000
Number of Outputs 410 410
Number of Terminals 900 900
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 6000 CLBS 6000 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA900,30X30,40 BGA900,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 31 mm 31 mm
Base Number Matches 1 1

Compare LFE2M50E-5FN900C with alternatives

Compare LFE2M50E-5F900C with alternatives