LFE2M100E-6F1152C
vs
LFE2M100SE-6F1152I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
FPBGA-1152
FPBGA-1152
Pin Count
1152
1152
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
357 MHz
357 MHz
Combinatorial Delay of a CLB-Max
0.331 ns
0.331 ns
JESD-30 Code
S-PBGA-B1152
S-PBGA-B1152
JESD-609 Code
e0
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of Inputs
520
520
Number of Logic Cells
100000
100000
Number of Outputs
520
520
Number of Terminals
1152
1152
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
11875 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
35 mm
Base Number Matches
1
1
Compare LFE2M100E-6F1152C with alternatives
Compare LFE2M100SE-6F1152I with alternatives