LFE2-70SE-7F900C
vs
LFE2-70E-7FN900I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
FPBGA-900
31 X 31 MM, LEAD FREE, FPBGA-900
Pin Count
900
900
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
420 MHz
Combinatorial Delay of a CLB-Max
0.304 ns
JESD-30 Code
S-PBGA-B900
S-PBGA-B900
JESD-609 Code
e0
e1
Length
31 mm
31 mm
Moisture Sensitivity Level
3
3
Number of Inputs
583
583
Number of Logic Cells
70000
68000
Number of Outputs
583
583
Number of Terminals
900
900
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
8500 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA900,30X30,40
BGA900,30X30,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
40
Width
31 mm
31 mm
Base Number Matches
1
1
Number of CLBs
8500
Compare LFE2-70SE-7F900C with alternatives
Compare LFE2-70E-7FN900I with alternatives