LF43891QC40
vs
HSP43891GM-25/883
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LOGIC DEVICES INC
|
INTERSIL CORP
|
| Part Package Code |
QFP
|
PGA
|
| Package Description |
QFP, QFP100,.7X.9
|
PGA-85
|
| Pin Count |
100
|
85
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ICC SPECIFIED @ 20MHZ
|
ICC SPECIFIED @ 20MHZ
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
25 MHz
|
25.6 MHz
|
| External Data Bus Width |
9
|
9
|
| JESD-30 Code |
R-PQFP-G100
|
S-CPGA-P85
|
| JESD-609 Code |
e0
|
e0
|
| Length |
20 mm
|
|
| Low Power Mode |
NO
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
100
|
85
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Data Bus Width |
26
|
26
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFP
|
PGA
|
| Package Equivalence Code |
QFP100,.7X.9
|
PGA84M,11X11
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
FLATPACK
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.1496 mm
|
|
| Supply Current-Max |
160 mA
|
160 mA
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
PIN/PEG
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
PERPENDICULAR
|
| Width |
14 mm
|
|
| uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, DIGITAL FILTER
|
DSP PERIPHERAL, DIGITAL FILTER
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
3A991.A.2
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare LF43891QC40 with alternatives
Compare HSP43891GM-25/883 with alternatives