LF356MWC
vs
LF356MWC
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
WAFER
|
|
| Package Description |
DIE, WAFER
|
,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.0002 µA
|
0.0002 µA
|
| Bias Current-Max (IIB) @25C |
0.0002 µA
|
|
| Common-mode Reject Ratio-Nom |
100 dB
|
100 dB
|
| Frequency Compensation |
YES
|
|
| Input Offset Current-Max (IIO) |
0.002 µA
|
|
| Input Offset Voltage-Max |
13000 µV
|
2000 µV
|
| JESD-30 Code |
X-XUUC-N
|
X-XXSS-X
|
| Low-Bias |
YES
|
|
| Low-Offset |
NO
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage Limit-Max |
-18 V
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
1
|
1
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIE
|
|
| Package Equivalence Code |
WAFER
|
|
| Package Shape |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Style |
UNCASED CHIP
|
SPECIAL SHAPE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Slew Rate-Nom |
12 V/us
|
12 V/us
|
| Supply Current-Max |
10 mA
|
|
| Supply Voltage Limit-Max |
18 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
BIFET
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
UNSPECIFIED
|
| Terminal Position |
UPPER
|
UNSPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Unity Gain BW-Nom |
5000
|
5000
|
| Voltage Gain-Min |
15000
|
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2016-05-06
|
|
|
|