LF355J8
vs
SG741SCM
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
LINFINITY MICROELECTRONICS
|
| Package Description |
DIP, DIP8,.3
|
DIP, DIP8,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
13000 µV
|
7500 µV
|
| JESD-30 Code |
R-XDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Low-Bias |
YES
|
|
| Low-Offset |
NO
|
NO
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Slew Rate-Min |
|
10 V/us
|
| Supply Voltage-Nom (Vsup) |
|
15 V
|
| Technology |
|
BIPOLAR
|
|
|
|
Compare LF355J8 with alternatives
Compare SG741SCM with alternatives