LE80539LF0342MX
vs
LE80537GF0484M
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
INTEL CORP
Part Package Code
BGA
BGA
Package Description
BGA,
BGA,
Pin Count
479
479
Reach Compliance Code
unknown
compliant
Address Bus Width
32
36
Boundary Scan
YES
NO
Clock Frequency-Max
667 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B479
S-PBGA-B479
Length
35 mm
35 mm
Low Power Mode
YES
YES
Number of Terminals
479
479
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, HEAT SINK/SLUG
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
2.163 mm
2.963 mm
Speed
667 MHz
2160 MHz
Supply Voltage-Max
1.3 V
1.3 V
Supply Voltage-Min
1.16 V
0.75 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
YES
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
1
Rohs Code
ECCN Code
3A991.A.1
HTS Code
8542.31.00.01
Bit Size
64
Technology
CMOS
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