LE79555-2BVC
vs
LE79555-2QC
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Part Package Code |
QFP
|
QFN
|
| Package Description |
GREEN, MS-026ACB, TQFP-44
|
8 X 8 MM, MO-220, QFN-32
|
| Pin Count |
44
|
32
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQFP-G44
|
S-XQCC-N32
|
| Length |
10 mm
|
8 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
32
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TQFP
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
SLIC
|
SLIC
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
8 mm
|
| Base Number Matches |
2
|
2
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare LE79555-2BVC with alternatives
Compare LE79555-2QC with alternatives