LE79555-1VC vs LE57D113TC feature comparison

LE79555-1VC Legerity

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LE57D113TC Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer LEGERITY INC MICROSEMI CORP
Part Package Code QFP QFP
Package Description TQFP, TQFP-44
Pin Count 44 44
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G44 S-PQFP-G44
JESD-609 Code e3 e3
Length 10 mm 10 mm
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 44 44
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TQFP HTQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE FLATPACK, HEAT SINK/SLUG, THIN PROFILE
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type SLIC SLIC
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 10 mm 10 mm
Base Number Matches 3 3
Pbfree Code No

Compare LE79555-1VC with alternatives

Compare LE57D113TC with alternatives