LE75183DQC
vs
LE75183BQC
feature comparison
Pbfree Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
LEGERITY INC
|
MICROSEMI CORP
|
Part Package Code |
QFN
|
QFN
|
Package Description |
HVQCCN,
|
HVQCCN,
|
Pin Count |
32
|
32
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-XQCC-N32
|
S-XQCC-N32
|
Length |
8 mm
|
8 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
8 mm
|
8 mm
|
Base Number Matches |
3
|
3
|
|
|
|
Compare LE75183DQC with alternatives
Compare LE75183BQC with alternatives