LE57D111DJC
vs
LE79555-2BVC
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
LEGERITY INC
|
| Part Package Code |
LCC
|
QFP
|
| Package Description |
QCCJ,
|
GREEN, PLASTIC, TQFP-44
|
| Pin Count |
32
|
44
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PQCC-J32
|
S-PQFP-G44
|
| JESD-609 Code |
e3
|
|
| Length |
13.97 mm
|
10 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
44
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
TQFP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK, THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.556 mm
|
1.2 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
SLIC
|
SLIC
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
11.43 mm
|
10 mm
|
| Base Number Matches |
3
|
3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
CMOS
|
|
|
|
Compare LE57D111DJC with alternatives
Compare LE79555-2BVC with alternatives