LE57D111DJC
vs
LE57D113TC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
LCC
QFP
Package Description
QCCJ,
TQFP-44
Pin Count
32
44
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PQCC-J32
S-PQFP-G44
JESD-609 Code
e3
e3
Length
13.97 mm
10 mm
Number of Functions
1
1
Number of Terminals
32
44
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
HTQFP
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
FLATPACK, HEAT SINK/SLUG, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.556 mm
1.2 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Telecom IC Type
SLIC
SLIC
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
10 mm
Base Number Matches
3
3
Pbfree Code
Moisture Sensitivity Level
3
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