LD27256 vs AS27C256-25JXT feature comparison

LD27256 Intel Corporation

Buy Now Datasheet

AS27C256-25JXT Micross Components

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP MICROSS COMPONENTS
Part Package Code DIP DIP
Package Description HERMETIC SEALED, CERAMIC, DIP-28 0.600 INCH, CERAMIC, DIP-28
Pin Count 28 28
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T28 R-CDIP-T28
JESD-609 Code e0
Length 37.084 mm
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code WDIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.5 V 12.5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.8928 mm
Supply Current-Max 0.1 mA 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 12 1
Standby Current-Max 0.0003 A

Compare LD27256 with alternatives

Compare AS27C256-25JXT with alternatives