LD155
vs
LD156
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
DIE
|
DIE
|
| Package Description |
DIE, DIE OR CHIP
|
DIE, DIE OR CHIP
|
| Pin Count |
7
|
7
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.0001 µA
|
0.0001 µA
|
| Common-mode Reject Ratio-Nom |
100 dB
|
100 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
7000 µV
|
7000 µV
|
| JESD-30 Code |
R-XUUC-N7
|
R-XUUC-N7
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
NO
|
NO
|
| Neg Supply Voltage-Nom (Vsup) |
-20 V
|
-20 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
7
|
7
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIE
|
DIE
|
| Package Equivalence Code |
DIE OR CHIP
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Slew Rate-Nom |
5 V/us
|
12 V/us
|
| Supply Current-Max |
4 mA
|
7 mA
|
| Supply Voltage-Nom (Vsup) |
20 V
|
20 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| Unity Gain BW-Nom |
2500
|
5000
|
| Base Number Matches |
5
|
4
|
|
|
|