LCMXO2-256HC-4SG32I
vs
LCMXO2-256HC-6SG32C
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
Package Description |
QFN-32
|
QFN-32
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Lattice Semiconductor
|
Lattice Semiconductor
|
Additional Feature |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY
|
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY
|
Clock Frequency-Max |
139 MHz
|
139 MHz
|
JESD-30 Code |
S-XQCC-N32
|
S-XQCC-N32
|
JESD-609 Code |
e3
|
e3
|
Length |
5 mm
|
5 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
32
|
32
|
Number of Inputs |
21
|
21
|
Number of Logic Cells |
256
|
256
|
Number of Outputs |
21
|
21
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
32 CLBS
|
32 CLBS
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC32,.2SQ,20
|
LCC32,.2SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Packing Method |
TRAY
|
TRAY
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.6 mm
|
0.6 mm
|
Supply Voltage-Max |
3.465 V
|
3.465 V
|
Supply Voltage-Min |
2.375 V
|
2.375 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
5 mm
|
5 mm
|
Base Number Matches |
1
|
1
|
Temperature Grade |
|
OTHER
|
|
|
|