LC5256MC-4F256C
vs
LC5256MC-5F256I
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
FPBGA-256
|
FPBGA-256
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
YES
|
YES
|
| In-System Programmable |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e0
|
e0
|
| JTAG BST |
YES
|
YES
|
| Length |
17 mm
|
17 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
141
|
141
|
| Number of Macro Cells |
256
|
256
|
| Number of Terminals |
256
|
256
|
| Organization |
0 DEDICATED INPUTS, 141 I/O
|
0 DEDICATED INPUTS, 141 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
225
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
4.8 ns
|
6 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.1 mm
|
2.1 mm
|
| Supply Voltage-Max |
1.95 V
|
1.95 V
|
| Supply Voltage-Min |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
Tin/Lead (Sn63Pb37)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
17 mm
|
17 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LC5256MC-4F256C with alternatives
Compare LC5256MC-5F256I with alternatives