LC4064ZE-4MN64C
vs
LC4064ZE-5MCN64C
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
5 X 5 MM, 0.5 MM PITCH, LEAD FREE, CSBGA-64
|
|
| Pin Count |
64
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Lattice Semiconductor
|
|
| Additional Feature |
YES
|
YES
|
| Clock Frequency-Max |
175 MHz
|
|
| In-System Programmable |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B64
|
S-PBGA-B64
|
| JESD-609 Code |
e1
|
|
| JTAG BST |
YES
|
YES
|
| Length |
5 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Dedicated Inputs |
4
|
|
| Number of I/O Lines |
48
|
|
| Number of Macro Cells |
64
|
64
|
| Number of Terminals |
64
|
64
|
| Organization |
4 DEDICATED INPUTS, 48 I/O
|
|
| Output Function |
MACROCELL
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
FBGA
|
| Package Equivalence Code |
BGA64,8X8,20
|
BGA64,8X8,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
4.7 ns
|
5.8 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max |
1.9 V
|
|
| Supply Voltage-Min |
1.7 V
|
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
5 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LC4064ZE-4MN64C with alternatives
Compare LC4064ZE-5MCN64C with alternatives