LB11683H-TLM-E
vs
LB11683H
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
SANYO SEMICONDUCTOR CO LTD
|
Package Description |
0.375 INCH, HSOP-28
|
HSSOP,
|
Pin Count |
28
|
28
|
Manufacturer Package Code |
943AE
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
onsemi
|
|
Additional Feature |
ALSO REQUIRES 5.5V TO 7V SUPPLY
|
ALSO REQUIRES 5.5V TO 7V SUPPLY
|
Analog IC - Other Type |
BRUSHLESS DC MOTOR CONTROLLER
|
BRUSHLESS DC MOTOR CONTROLLER
|
JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
JESD-609 Code |
e6
|
|
Length |
15.2 mm
|
15.2 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-30 °C
|
-30 °C
|
Output Current-Max |
1.5 A
|
1.5 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HSSOP
|
HSSOP
|
Package Equivalence Code |
SOP28/36,.4,32
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.45 mm
|
2.45 mm
|
Supply Current-Max (Isup) |
15 mA
|
|
Supply Voltage-Max (Vsup) |
13.8 V
|
13.8 V
|
Supply Voltage-Min (Vsup) |
7 V
|
7 V
|
Supply Voltage-Nom (Vsup) |
12 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN BISMUTH
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.9 mm
|
7.9 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
SOIC
|
|
|
|