LAN91C93I-ME
vs
LAN91C93I-MC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STANDARD MICROSYSTEMS CORP
|
STANDARD MICROSYSTEMS CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
TFQFP, TQFP100,.63SQ
|
QFP, QFP100,.7X.9
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
20
|
20
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| Communication Protocol |
ASYNC, BIT; SYNC, BYTE; ETHERNET
|
ASYNC, BIT; ETHERNET
|
| Data Encoding/Decoding Method |
NRZ; BIPH-LEVEL (MANCHESTER)
|
NRZ; BIPH-LEVEL (MANCHESTER)
|
| Data Transfer Rate-Max |
1.25 MBps
|
1.25 MBps
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| Length |
14 mm
|
20 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Serial I/Os |
2
|
2
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFQFP
|
QFP
|
| Package Equivalence Code |
TQFP100,.63SQ
|
QFP100,.7X.9
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
3.4 mm
|
| Supply Current-Max |
95 mA
|
95 mA
|
| Supply Voltage-Max |
3.63 V
|
3.63 V
|
| Supply Voltage-Min |
2.97 V
|
2.97 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
20 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
| Base Number Matches |
1
|
1
|
|
|
|