LAN88730BMR-C
vs
KSZ8895MQXIA
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HVQCCN,
|
FQFP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-XQCC-N32
|
R-PQFP-G128
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 mm
|
20 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
128
|
| Operating Temperature-Max |
105 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
FQFP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, FINE PITCH
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
0.9 mm
|
3.4 mm
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET SWITCH
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Data Rate |
|
100000 Mbps
|
| Moisture Sensitivity Level |
|
3
|
| Number of Transceivers |
|
5
|
| Package Equivalence Code |
|
QFP128,.68X.91,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
CMOS
|
|
|
|
Compare LAN88730BMR-C with alternatives
Compare KSZ8895MQXIA with alternatives