LAN8710AI-EZK
vs
LAN8742AI-CZ-TR
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFN
|
|
Package Description |
5 X 5 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-32
|
4 X 4 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFN-24
|
Pin Count |
32
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
54 Weeks, 1 Day
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Data Rate |
100000 Mbps
|
100000 Mbps
|
JESD-30 Code |
S-XQCC-N32
|
S-PQCC-N24
|
JESD-609 Code |
e3
|
e3
|
Length |
5 mm
|
4 mm
|
Moisture Sensitivity Level |
3
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
24
|
Number of Transceivers |
1
|
1
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC32,.2SQ,20
|
LCC24,.16SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
5 mm
|
4 mm
|
Base Number Matches |
4
|
1
|
|
|
|
Compare LAN8710AI-EZK with alternatives
Compare LAN8742AI-CZ-TR with alternatives