LAN7800/Y9X
vs
USB5806-I/KD
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
SQFN-48
|
VQFN-100
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.31.00.01
|
Factory Lead Time |
6 Weeks
|
|
Date Of Intro |
2016-10-17
|
2016-10-03
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Address Bus Width |
|
|
Boundary Scan |
NO
|
|
Clock Frequency-Max |
25 MHz
|
25 MHz
|
Communication Protocol |
ASYNC, BIT
|
|
Data Transfer Rate-Max |
625 MBps
|
625 MBps
|
JESD-30 Code |
S-XQCC-N48
|
S-XQCC-N100
|
JESD-609 Code |
e3
|
e3
|
Length |
7 mm
|
12 mm
|
Low Power Mode |
YES
|
|
Number of I/O Lines |
8
|
|
Number of Serial I/Os |
10
|
|
Number of Terminals |
48
|
100
|
On Chip Data RAM Width |
8
|
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC48,.28SQ,20
|
LCC100,.47SQ,16
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
RAM (words) |
512
|
|
Seated Height-Max |
1 mm
|
0.9 mm
|
Supply Voltage-Max |
3.63 V
|
1.32 V
|
Supply Voltage-Min |
2.97 V
|
1.08 V
|
Supply Voltage-Nom |
3.3 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
7 mm
|
12 mm
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
Base Number Matches |
1
|
1
|
Bus Compatibility |
|
I2C; SMBUS; SPI; UART
|
Screening Level |
|
TS 16949
|
|
|
|
Compare LAN7800/Y9X with alternatives
Compare USB5806-I/KD with alternatives