LAI101PTR vs ISO253P feature comparison

LAI101PTR IXYS Integrated Circuits Division

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ISO253P Burr-Brown Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IXYS INTEGRATED CIRCUITS DIVISION BURR-BROWN CORP
Part Package Code SOIC
Package Description SOP, DIP, DIP28,.6
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type ISOLATION AMPLIFIER ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom 0.04 MHz 0.05 MHz
Common Mode Voltage-Max 3747 V 1500 V
Isolation Voltage-Min 3750 V 1500 V
JESD-30 Code R-PDSO-G16 R-PDMA-T16
Neg Supply Voltage Limit-Max -18 V
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Supply Voltage Limit-Max 18 V 18 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount YES NO
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP28,.6
Supply Current-Max 55 mA
Technology HYBRID
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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