L8C401CM25
vs
C57401J
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
LOGIC DEVICES INC
Part Package Code
DIP
Package Description
DIP,
Pin Count
16
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
15 ns
Cycle Time
25 ns
JESD-30 Code
R-GDIP-T16
Length
20.32 mm
Memory Density
36864 bit
Memory IC Type
OTHER FIFO
Memory Width
9
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
16
Number of Words
64 words
Number of Words Code
4000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
4KX9
Output Characteristics
TOTEM POLE
Output Enable
NO
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Supply Current-Max
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
7.62 mm
Base Number Matches
1
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