L8C401CM25 vs C57401J feature comparison

L8C401CM25 LOGIC Devices Inc

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C57401J

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Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer LOGIC DEVICES INC
Part Package Code DIP
Package Description DIP,
Pin Count 16
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 15 ns
Cycle Time 25 ns
JESD-30 Code R-GDIP-T16
Length 20.32 mm
Memory Density 36864 bit
Memory IC Type OTHER FIFO
Memory Width 9
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 16
Number of Words 64 words
Number of Words Code 4000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 4KX9
Output Characteristics TOTEM POLE
Output Enable NO
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm
Base Number Matches 1

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