L8C203PC50 vs 5962-8956704XX feature comparison

L8C203PC50 LOGIC Devices Inc

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5962-8956704XX Integrated Device Technology Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LOGIC DEVICES INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 65 ns 65 ns
JESD-30 Code R-PDIP-T28 R-GDIP-T28
Length 35.052 mm 37.1475 mm
Memory Density 18432 bit 18432 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 2KX9 2KX9
Output Characteristics 3-STATE
Output Enable NO NO
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 5.08 mm
Supply Current-Max 0.08 mA 0.15 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 3
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare L8C203PC50 with alternatives

Compare 5962-8956704XX with alternatives