L8C203CM25 vs IDT7203L25JI feature comparison

L8C203CM25 LOGIC Devices Inc

Buy Now Datasheet

IDT7203L25JI Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LOGIC DEVICES INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP QFJ
Package Description DIP, PLASTIC, LCC-32
Pin Count 28 32
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 25 ns 25 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 35 ns 35 ns
JESD-30 Code R-GDIP-T28 R-PQCC-J32
Length 36.83 mm 13.97 mm
Memory Density 18432 bit 18432 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 3 1
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 2KX9 2KX9
Output Characteristics 3-STATE
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 3.55 mm
Supply Current-Max 0.09 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 15.24 mm 11.43 mm
Base Number Matches 1 2
Pbfree Code No
Clock Frequency-Max (fCLK) 28.5 MHz
JESD-609 Code e0
Package Equivalence Code LDCC32,.5X.6
Standby Current-Max 0.002 A
Terminal Finish Tin/Lead (Sn85Pb15)
Time@Peak Reflow Temperature-Max (s) 20

Compare L8C203CM25 with alternatives

Compare IDT7203L25JI with alternatives