L8C201KME20
vs
KM75C101AP-20
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LOGIC DEVICES INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
QFJ
DIP
Package Description
QCCN,
DIP, DIP28,.6
Pin Count
32
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
20 ns
20 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
30 ns
30 ns
JESD-30 Code
R-CQCC-N32
R-PDIP-T28
Length
14 mm
37.1 mm
Memory Density
4608 bit
4608 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
32
28
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
512X9
512X9
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
QCCN
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.048 mm
5.08 mm
Supply Current-Max
0.1 mA
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
11.43 mm
15.24 mm
Base Number Matches
1
1
Pbfree Code
Clock Frequency-Max (fCLK)
33 MHz
JESD-609 Code
e0
Package Equivalence Code
DIP28,.6
Standby Current-Max
0.005 A
Terminal Finish
TIN LEAD
Compare L8C201KME20 with alternatives
Compare KM75C101AP-20 with alternatives