L7C199TMB20
vs
WS128K32-55HSM
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LOGIC DEVICES INC
|
WHITE ELECTRONIC DESIGNS CORP
|
Part Package Code |
QFJ
|
|
Package Description |
QCCN, LCC32,.45X.55
|
1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
Pin Count |
32
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
20 ns
|
55 ns
|
Additional Feature |
AUTOMATIC POWER-DOWN; LOW POWER OPERATION; BATTERY BACKUP OPERATION
|
USER CONFIGURABLE AS 128K X 32
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-CQCC-N32
|
S-CPGA-P66
|
JESD-609 Code |
e0
|
|
Length |
13.97 mm
|
30.1 mm
|
Memory Density |
262144 bit
|
4194304 bit
|
Memory IC Type |
STANDARD SRAM
|
SRAM MODULE
|
Memory Width |
8
|
16
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
|
Number of Terminals |
32
|
66
|
Number of Words |
32768 words
|
262144 words
|
Number of Words Code |
32000
|
256000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
32KX8
|
256K16
|
Output Characteristics |
3-STATE
|
|
Output Enable |
YES
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCN
|
PGA
|
Package Equivalence Code |
LCC32,.45X.55
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
CHIP CARRIER
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
225
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
MIL-STD-883
|
Seated Height-Max |
3.048 mm
|
6.22 mm
|
Standby Current-Max |
0.0002 A
|
|
Standby Voltage-Min |
2 V
|
|
Supply Current-Max |
0.145 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
NO LEAD
|
PIN/PEG
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
PERPENDICULAR
|
Width |
11.43 mm
|
30.1 mm
|
Base Number Matches |
2
|
1
|
Alternate Memory Width |
|
8
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare L7C199TMB20 with alternatives
Compare WS128K32-55HSM with alternatives