L7C181CM20 vs IDT6178S12DB feature comparison

L7C181CM20 LOGIC Devices Inc

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IDT6178S12DB Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LOGIC DEVICES INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, DIP22,.3 0.300 INCH, CERAMIC, DIP-22
Pin Count 22 22
Reach Compliance Code unknown not_compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 12 ns
Additional Feature AUTOMATIC POWER-DOWN; MATCH OUTPUT; FLASH CLEAR
JESD-30 Code R-GDIP-T22 R-GDIP-T22
JESD-609 Code e0 e0
Length 27.178 mm 27.051 mm
Memory Density 16384 bit 16384 bit
Memory IC Type CACHE TAG SRAM CACHE TAG SRAM
Memory Width 4 4
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 22 22
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 4KX4 4KX4
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP22,.3 DIP22,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Standby Current-Max 0.00005 A
Standby Voltage-Min 2 V 4.5 V
Supply Current-Max 0.075 mA 0.18 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
I/O Type COMMON
Screening Level MIL-STD-883 Class B

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